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Encapsulation for flexible electronic devices

journal contribution

posted on 2023-06-08, 19:59 authored by T Kinkeldei, Niko Munzenrieder, C Zysset, K Cherenack, G Tröster

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History

Publication status

Published

Journal

IEEE Electron Device Letters

ISSN

0741-3106

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

External DOI

https://doi.org/10.1109/LED.2011.2168378

Issue

12

Volume

32

Page range

1743-1745

Department affiliated with

Engineering and Design Publications

Full text available

No

Peer reviewed?

Yes

Legacy Posted Date

2015-02-06

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